An interconnect system made of copper, as compared to aluminum which is widely used today in the semiconductor industry, has electromigration effects and therefore can carry a higher maximum current density and allow faster transport of electrons. The process of the invention requires a minimal number of steps and does not need a seed layer, thus reducing production costs and drastically lowering contamination rates.
Technical Details:
Johns Hopkins seeks a partner to market a novel invention which addresses the need for fast, reliable, performance-oriented interconnects and vias in today's and tomorrow's smaller, faster circuit systems. Specifically, it is a process for producing an interconnect layer of continuous copper, with excellent step coverage and superior adhesion characteristics. While principally directed towards metallizing silicon-based integrated circuits, the invention may also be applicable to other integrated circuits and layered structures.
Looking for Partners:
Integrated circuits, Layered structures
