Three Dimensional Microwell Array

Case ID:
C11150
Disclosure Date:
6/22/2010

C11150: Three Dimensional Microwell Array

Value Proposition:

Parallel encapsulation of living cargo in an array format while enabling interaction with the surrounding in all three dimensions. Increased surface to volume ratios allow preventing cell death related to hypoxia and in general to lack of nutrients resulting in increased efficiency of bioartificial devices.

Technical Details:

Traditional microwell arrays are inherently two dimensional allowing encapsulated living cargo e.g. cells to access the surroundings from only one opening (a 2D interface). We describe and realize the concept of 3D microwell arrays; here chemical transport can occur in all three dimensions thus improving the cargo's viability.

Looking for Partners:

Bioartificial Cell Encapsulation Devices.



Patent Information:
Title App Type Country Serial No. Patent No. File Date Issued Date Expire Date Patent Status
Three Dimensional Microwell Array PCT: Patent Cooperation Treaty United States 13/806,042 9,545,772 12/20/2012 1/17/2017 6/24/2031 Granted
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For Information, Contact:
Lisa Schwier
lschwie2@jhu.edu
410-614-0300
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