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Copper Metallization Structure and Method of Construction
C01417: Copper Metallization Structure and Method of ConstructionValue Proposition: An interconnect system made of copper, as compared to aluminum which is widely used today in the semiconductor industry, has electromigration effects and therefore can carry a higher maximum current density and allow faster transport of electrons. The process of the...
Published: 3/13/2025
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Inventor(s):
Philippe Vereecken
,
John Long
,
Peter Hoffmann
,
Peter Searson
,
Gerko Oskam
Keywords(s):
Circuitry
,
Disease Indication
,
Industrial Manufacturing
,
Manufactured Devices
Category(s):
Technology Classifications > Industrial Tech > Energy, Infrastructure & Environment
,
Technology Classifications > Industrial Tech > Industrial Manufacturing
,
Technology Classifications > Industrial Tech
,
Technology Classifications > Engineering Tech > Energy, Infrastructure & Environment
,
Technology Classifications > Engineering Tech > Industrial Manufacturing
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