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Copper Metallization Structure and Method of Construction

C01417: Copper Metallization Structure and Method of ConstructionValue Proposition: An interconnect system made of copper, as compared to aluminum which is widely used today in the semiconductor industry, has electromigration effects and therefore can carry a higher maximum current density and allow faster transport of electrons. The process of the...

Published: 3/13/2025 | Inventor(s): Philippe Vereecken, John Long, Peter Hoffmann, Peter Searson, Gerko Oskam

Keywords(s): Circuitry, Disease Indication, Industrial Manufacturing, Manufactured Devices

Category(s): Technology Classifications > Industrial Tech > Energy, Infrastructure & Environment, Technology Classifications > Industrial Tech > Industrial Manufacturing, Technology Classifications > Industrial Tech, Technology Classifications > Engineering Tech > Energy, Infrastructure & Environment, Technology Classifications > Engineering Tech > Industrial Manufacturing